Direct Liquid Cooling

Direct Liquid Cooling (DLC) removes heat from processors, GPUs, and memory by circulating coolant through cold plates or immersion tanks in direct contact with heat-generating components. Unlike air cooling, DLC sustains rack densities of 100 kW or more — essential for modern GPU clusters (NVIDIA H100/H200, AMD MI300X). The three main approaches are: rear-door heat exchangers (passive), direct-to-chip cold plates (active CDU), and full immersion (single or two-phase). DLC significantly reduces hot air in the data hall and often achieves PUE below 1.05.